Dynamic mechanical thermal analysis of cured epoxy resin by capsulated 1-methylimidazole curing agent for making advanced composites

Among the methods of forming latent curing agent for epoxy resins, the encapsulation of the curing agent is a promising method. These systems have been used in one-part thermosetting adhesives or making prepregs which can be used in developing advanced composite materials. In this study, a new approach was proposed to reduce the disadvantage of thermoplastic polymer shell of microcapsules by using a thermosetting solid epoxy resin. The results of dynamic mechanical properties of these new microcapsule-cured epoxy resins showed that in the presence of microcapsules the cured epoxy resin systems became single-phase and its storage modulus did not reduced. Differential scanning calorimetry test also confirmed this one phase system. Scanning electron microscopic investigation of fractured surface of microcapsules-cured epoxy resin showed a relatively uniform morphology. Results also show that the height of tan δ peak of the cured epoxy resin by capsulated 1-methylimidazole curing agent is increased

Keywords:

Epoxy resin , Curing agent , Dynamic mechanical thermal analysis , Microencapsulation , Solid epoxy