Experimental Study of Thermal -Hydraulic Performance of a Novel Microchannel Heat Sink for Electronic Cooling Application

The thermal-hydraulic performance of a novel microchannel heat sink has been investigated using an experimental study. The heat sink is made of copper and consisted of 40 microchannels that each microchannel has a width of 216 μm, depth of 400 μm, and a length of 25 mm. The Reynolds number is in the range of 300 to 900, and the heat flux applied at the bottom surface of the channels is 50 2 / W cm that provide by four cartridge heaters. The results of the present study compared with the valid experimental data and have good agreement with the trend reported in the previous studies. With increasing the Reynolds number from 300 to 900, the Nusselt number increased by 72.8%, and the friction factor decreased by 68.8%. The main novelty of the present microchannel heat sink is the integrated design of the manifolds and channels and the I-type configuration. This configuration brings the heat sink closer to the applicable and commercial models. To predict the maximum removable heat flux in the laminar flow range by the designed heat sink, a linear regression of the Nusselt number versus the Reynolds number is performed. It is found that in the Reynolds number of 2200, the heat flux of 125 W/cm2 can be removed by the designed microchannel heat sink.

Keywords:

Microchannel heat sink , Electronic cooling , I-type configuration , heat transfer