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The study of deposition parameters on the growth of silicon dioxide films deposited on InSb by plasma enhanced chemical vapor deposition method

عنوان مقاله: The study of deposition parameters on the growth of silicon dioxide films deposited on InSb by plasma enhanced chemical vapor deposition method
شناسه ملی مقاله: PHOTONICS03_041
منتشر شده در سومین کنفرانس مهندسی فوتونیک ایران در سال 1389
مشخصات نویسندگان مقاله:

Gh Sareminia - aSAiran-Electronic Components Industry (ECI)-Optoelectronic industry, Tehran, Iran.
M Heidari Saani - aSAiran-Electronic Components Industry (ECI)-Optoelectronic industry, Tehran, Iran.
Ar Karamian - bMathematics department, Razi University Kermanshah, Iran
Ao .Alipour - aSAiran-Electronic Components Industry (ECI)-Optoelectronic industry, Tehran, Iran.

خلاصه مقاله:
In this paper we report the growth and characterization of silicon dioxide films depositedon<111>InSb(B-face).The high performance Au/Cr/SiO2/InSb/Au metal-insulatorsemiconductor was fabricated by evaporation of metals in vacuum.The effects of N2O/SiH4 flow rate, deposition pressure and SiH4 gas flow rate on deposition rate, etch rate and uniformity of silicon dioxide films were investigated. The C-V results show that at 77 K MIS structure there are positive charges in the silicon dioxide films and interface .The dielectric constant and refractive index of PECVD deposited films was compared with dielectric constant and refractive index of thermally grown films.

کلمات کلیدی:
PECVD, SiH4, Etch Rate, Deposition Rate, Dielectric Constant

صفحه اختصاصی مقاله و دریافت فایل کامل: https://civilica.com/doc/105647/