Mehran Fathzadeh - MSc Student, School of Mechanical Engineering, College of Engineering, University of Tehran, Tehran, Iran
Mohammad Saberi - MSc Student, School of Mechanical Engineering, College of Engineering, University of Tehran, Tehran, Iran
Masoud Ajric - Senior Engineer, Electronic R&I, Crouse Company, Tehran, Iran
Farzad A. Shirazi - Corresponding author, Assistant Professor, School of Mechanical Engineering, College of Engineering, University of Tehran, Tehran, Iran

Nowadays, electronic circuit boards play an essential role in most industries such as automotive, aerospace, oil, etc. Therefore, they should operate properly in different conditions including thermal cycling, vibrations, and mechanical shock. An electronic package consists of Printed Circuit Boards (PCBs) placed in a casing joined together. Electronic components such as ICs, capacitors, and resistors are mounted on the PCB. The electronic equipment is subjected to severe vibrations during its lifetime and these vibrations can damage electronic components. In this work, the fatigue life estimation of wires and solder joints under sinusoidal and random vibrations are estimated using the Steinberg's method. The results show that random vibration has more effect than sinusoidal vibration on the fatigue life of solder joints and wires according to the Peugeot standard. Also, the results pass the Peugeot standard qualification in both random and harmonic vibrations. The least fatigue life was obtained for the small capacitor in the circuit

fatigue life estimation; Steinberg's method, random and harmonic excitations