Hadi Amirshaghaghi - PhD Candidate, School of Mechanical Engineering, Faculty of Engineering, University of Tehran
Mohammad Homayunfar - Research Associate, School of Mechanical Engineering, Sharif University of Technology

A viscoplastic finite element model is developed to determine the time-dependent solder joint fatigue response of Ball Grid Arrays (BGAs) under both accelerated temperature cycling conditions and extreme temperatures due to aerodynamic heating. The modeling approach qualitatively is verified using the results of accelerated thermal cycling tests, available in literature. The validated model then, implemented to investigate the effects of differing solder ball configurations due to variations in package and avionic block assembly as well as the design parameters.

Ball grid array package-Solder fatigue- Finite element modeling- Accelerated Thermal Cycling-Extreme Temperatures