Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free solder Sn-۳.۰Ag-۰.۵Cu (SAC۳۰۵) is methodically investigated using Discrete Phase Model (DPM) simulation and applied on a ۰۱۰۰۵ capacitor component. Different types of nanoparticles, namely titanium dioxide (TiO۲), nickle oxide (NiO) and Iron (III) oxide (Fe۲O۳) with varying weight percentages, ۰.۰۱wt%, ۰.۰۵wt% and ۰.۱۵wt% that is doped in SAC۳۰۵ are used. The study of two-way interactions between multiphase volume of fluid (VOF) and discrete phase model (DPM) shows excellent capability in tracking the dispersed nanoparticles immersed in the wetted molten solder. In this study, real reflow profile temperature setup will be used to mimic the conventional reflow process. Based on the findings, the fillet height managed to achieve the minimum required height set by IPC standards. As the concentration of the nanoparticles doped in the molten solder increases, higher time is required for the wetting process. In general, the doped NiO nanoparticles at ۰.۰۵wt% has the lowest wetting time compared to other cases. The study of the instantaneous nanoparticles trajectory tracking was also conducted on a ۳D model and ۲D cross sectional view to identify the exact movement of the particles. Additionally, it was also observed that the velocity and pressure distribution increases as the weight percentage of the nanoparticles increases.

Keywords:

Nanoparticle , SAC۳۰۵ , Nanocomposite solder paste , Numerical simulation , Discrete phase model