Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach

ABSTRACT This study investigated the effects of temperature on the wave soldering of printed circuit boards (PCBs) using three-dimensional finite volume analysis. A computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using tetrahedral elements. The leaded molten solder (Sn۶۳Pb۳۷) distribution and PCB wetting profile were determined using the volume of fluid technique in the fluid flow solver, FLUENT. In this study, the effects of five different molten solder temperatures (۴۵۶ K, ۴۷۳ K, ۵۲۳ K, ۵۸۳ K, and ۶۴۳ K) on the wave soldering of a ۷۰ mm × ۱۴۶ mm PCB were considered. The effects of temperature on wetting area, wetting profile, velocity vector, and full wetting time were likewise investigated. Molten solder temperature significantly affected the wetting time and distribution of PCBs. The molten solder temperature at ۵۲۳ K demonstrated desirable wetting distribution and yielded a stable fountain profile and was therefore considered the best temperature in this study. The simulation results were substantiated by the experimental results.

Keywords:

Wave soldering , Wetting area , Volume of fluid (VOF) , Finite volume method , Printed circuit board (PCB)