Preparation of Silicon-Based Polyimide Nanofoams with High Heat Stability and Low Dielectric Constant

Aromatic polyimides are well accepted as high performance polymers and they are well as high temperature resistant materials. They exhibit favorable balance of physical and chemical properties and show excellent thermal, mechanical and electrical properties, so they are the prime candidates polymeric insulator in microelectronic industrials [1-3]. In recent years, several studies have been contributed to the preparation ofthe low dielectric constant polyimides. In this article, the preparation of new nanoporous thin films of silicone-based polyimides was described. These polyimides were prepared from graft copolymers consisting of a polyimide block as continuous phase and poly (propylene glycol) as disperse phase