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تاثیر دما بر ریزساختار و لایه واکنشی فصل مشترک Zr/Ti در اتصال نفوذی Zr۷۰۲ به فولاد A۵۱۶

عنوان مقاله: تاثیر دما بر ریزساختار و لایه واکنشی فصل مشترک Zr/Ti در اتصال نفوذی Zr۷۰۲ به فولاد A۵۱۶
شناسه ملی مقاله: JR_JWSTI-8-2_011
منتشر شده در در سال 1401
مشخصات نویسندگان مقاله:

علی پورجعفر - Department of Materials Science & Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz, Iran
رضا دهملایی - Department of Materials Science & Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz, Iran
سید رضا علوی زارع - Department of Materials Science & Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz, Iran
خلیل رنجبر - Department of Materials Science & Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz, Iran
محمد رضا توکلی شوشتری - Department of Materials Science & Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz, Iran

خلاصه مقاله:
In this study, the effect of temperature on the microstructure and reactive layer at the interface between the Ti interlayer and the base metal related to the diffusion bonding of Zr۷۰۲ to A۵۱۶ low alloy steel was investigated. The joining was done using the spark plasma sintering technique at temperatures of ۹۰۰, ۹۵۰ and ۱۰۰۰°C for ۳۰ minutes. Field Emission Scanning Electron Microscope (FESEM) equipped with EDS analysis was used to investigate the microstructure of the interfaces in various joints. Investigations showed that at all temperatures, with the diffusion of atoms and the formation of a reactive layer between the Ti interlayer and Zr۷۰۲, no intermetallic phases, cracks, porosity and discontinuities were formed at their interfaces. . It was found that increasing the bonding temperature did not cause the formation of new phases and compounds in the interface and only increased the thickness of the reaction layer. The measurement of the thickness of the reactive layer showed that the maximum and minimum amounts of diffusion were ۸۴ microns at ۱۰۰۰ °C and ۶۴ microns at ۹۰۰ °C respectively

کلمات کلیدی:
Diffusion bonding, Interlayer, diffusion Interface, reaction layer, Zr۷۰۲, SPDB Technique, اتصال نفوذی, لایه میانی, فصل مشترک نفوذ, لایه واکنشی, Zr۷۰۲, تکنیک SPDB

صفحه اختصاصی مقاله و دریافت فایل کامل: https://civilica.com/doc/1647994/