Zoheir Kordrostami - Department of Electrical Engineering, School of Engineering, Shiraz University,Iran
Mohammad Hossein Sheikhi - Department of Electrical Engineering, School of Engineering, Shiraz University,Iran

Metallic carbon nanotubes have been attracted immense popularity as ideal interconnects for future technology generations. However much of the recent attentions in modeling nanotutbein terconnectsh ave beenp aid to single wall carbon nanotutbes (SIttrNTs) and treated multitvall carbon nanotubes (MWNTs) the same as SWNTs considering the conduction of the MWNT only through its outer shell. But recent improvements in contacting the inner shells of MIWTs and their contribution in conduction, demonstrated the distinct specifications of WIrNTs. In this paper, we present a new circuit model for MWNT interconnects that cqn simulate these dffirences and is in good agreement with experimental measurements. Comparisons have been made between multiwall and single wall carbon nanotube interconnects that show the improved performance capabilities of MWNTs.

Circuit model, multiwall carbon nanotubei,n terconnects,w itchingd elay