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Paper
Title

Thermal Analysis of Sintered Silver Nanoparticles Film

کنفرانس دو سالانه بین المللی مکانیک جامدات تجربی
Year: 1392
COI: WMECH02_060
Language: EnglishView: 640
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Authors

Mahdi Keikhaie - Center of Excellence in Design, Robotics and Automation, Department of Mechanical Engineering, Sharif University of Technology, Azadi Ave, ۱۴۵۸۸-۸۹۶۹۴, Tehran, Iran
Javad Akbari - Center of Advanced Manufacturing and Material Processing-Micro Mechanism Research Group, Department of Engineering Design and Manufacture, Faculty of Engineering, University of Malaya, ۵۰۶۰۳, Kuala Lumpur, Malaysia.
Mohammad R. Movahhedy - Center of Excellence in Design, Robotics and Automation, Department of Mechanical Engineering, Sharif University of Technology, Azadi Ave, ۱۴۵۸۸-۸۹۶۹۴, Tehran, Iran
Hamid Alemohammad - Department of Mechanical and Mechatronics Engineering, University of Waterloo, ۲۰۰ University Ave West, Waterloo, N۲L ۳G۱, Canada.

Abstract:

Thin bonded films have many applications in coating and semiconductor industries. Thermal conductivity is one of the important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in materials play very important role on the effective thermal conductivity. In this paper, finite element method (FEM) was utilized to simulate the effect of pores on the effective thermal conductivity of sintered silver nanoparticles film. The simulation results indicate that the effective thermal conductivity of film is different at different directions and would be enhanced when the pore angle is 90. The simulation results will help us to further understand the heat transfer process across highly porous structures and will provide us a powerful guide to design coating with high thermal insulation or conductor property.

Keywords:

Paper COI Code

This Paper COI Code is WMECH02_060. Also You can use the following address to link to this article. This link is permanent and is used as an article registration confirmation in the Civilica reference:

https://civilica.com/doc/263997/

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Keikhaie, Mahdi and Akbari, Javad and R. Movahhedy, Mohammad and Alemohammad, Hamid,1392,Thermal Analysis of Sintered Silver Nanoparticles Film,The Bi-Annual International Conference on Experimental Solid Mechanics (X-Mech-2014),Tehran,https://civilica.com/doc/263997

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Type of center: دانشگاه دولتی
Paper count: 14,809
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