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Novel Asymmetric Gate Oxide Thickness Technology for Reduction of Gate Induced Drain Leakage Current in Nanoscale MOSFET Device for Low Power Applications

عنوان مقاله: Novel Asymmetric Gate Oxide Thickness Technology for Reduction of Gate Induced Drain Leakage Current in Nanoscale MOSFET Device for Low Power Applications
شناسه ملی مقاله: ICEE16_339
منتشر شده در شانزدهمین کنفرانس مهندسی برق ایران در سال 1387
مشخصات نویسندگان مقاله:

Morteza Fathipour - Device Modeling and simulation Lab, ECE Dep. Tehran University , Tehran
Mahdi Vadizadeh
Zahra Ahangari
Fatemeh Kohani

خلاصه مقاله:
Gate Induced Drain Leakage (GIDL) current is one of the main leakage current components in MOSFET structure and plays an important role in data retention time of DRAM cells. GIDL can dominate the drain leakage current at zero bias and will limit the scalability of the MOSFET structure for low power applications. In this paper we propose a novel technique for reducing GIDL and hence off-state current in the nanoscale MOSFET structure. Proposed structure employs asymmetric gate oxide thickness which can reduce GIDL current an order of magnitude in comparison with the symmetric gate oxide thickness structure without sacrificing driving current.

کلمات کلیدی:
Band To Band Tunnelling (BTBT), Gate Induced Drain Leakage, Short Channel Effects and Trap Assisted Tunnelling (TAT)

صفحه اختصاصی مقاله و دریافت فایل کامل: https://civilica.com/doc/47837/