Cure Kinetic of Structural Epoxy Adhesive Film by Dynamic Differential Scanning Calorimetry

The processing of thermosetting epoxy resins with curing agent involves the exposure of the materials to varying levels of curing profiles which are dependent on the curing kinetics.Therefore knowledge of the curing kinetics is of great importance to achieve optimum material properties. Theunderstanding of the cure kinetics that will delineate the curecycle to be used in the processing of adhesive film is of fundamental importance for good quality advancedcomposites. In this work, the cure behavior of a commercial and widely used epoxy adhesive film, AF163-2K, was studiedby dynamic DSC at different heating rates