DIC technique for measuring crack propagation within ۳D printed specimen in the fracture test for polymeric materials
Publish place: 30th Annual International Conference of the Iranian Association of Mechanical Engineers
Publish Year: 1401
نوع سند: مقاله کنفرانسی
زبان: English
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شناسه ملی سند علمی:
ISME30_155
تاریخ نمایه سازی: 29 خرداد 1401
Abstract:
The current investigation provides a novel insight into determining crack growth length in the fracture test for polymeric materials. Eleven Single Edge Notched Bend (SENB) beams, which were three-dimensional (۳D) printed by using Acrylonitrile Butadiene Styrene (ABS) filament, were experimentally subjected to fracture test according to ASTM D۶۰۶۸-۱۰. In this standard (conventional method), the crack growth length is measured by using a Crack Propagation Gauge (CPG) or Digital Microscope (DM), which are not accurate enough compared to the introduced innovative technique. In the present approach, Digital Image Correlation (DIC) analysis is efficiently employed to measure crack extension, which has not been hitherto introduced in the literature. The distinctive advantage of using this new procedure is that crack growth length can be measured more accurately. Thus, a more realistic fracture toughness value is obtained. The difference between amounts of fracture toughness calculated by both methods is ۱۷.۱۴%, which shows the importance of utilizing this novel technique.
Keywords:
fracture test , measuring crack growth length , ۳D printing process , DIC technique , fracture toughness
Authors
H. Geramizadeh
Department of Mechanical Engineering, Central Tehran Branch, Islamic Azad University, Tehran, Iran;
S. Jedari Salami
Department of Biomedical Engineering, Central Tehran Branch, Islamic Azad University, Tehran, Iran;
S. Dariushi
Department of Composite, Faculty of Processing, Iran Polymer and Petrochemical Institute, Tehran, Iran;