Optimizing heatsink performance through Integration of Active and Passive Cooling Strategies Utilizing the Taguchi Method

In the dynamic landscape of technology, where electronic components continually shrink in size, the escalating thermal output from these devices has become a notable concern. Effective cooling strategies are essential for achieving optimal operational efficiency. Electronic component cooling methods can be broadly categorized into two types: active and passive. An intriguing approach to improve heat dissipation involves integrating phase-change materials (PCM) between the fins of heatsinks. However, it's important to recognize that these materials inherently have relatively low thermal conductivity. To address this challenge, incorporating a porous media proves effective to some extent. Nevertheless, preventing the leakage of PCMs poses a significant obstacle. One viable solution involves encapsulating these materials. Simultaneously, the strategic application of fluid flow emerges as a pivotal factor in regulating the temperatures of electronic components. This research investigates the simultaneous influences of a heatsink, fan, PCM, and fluid flow. The Taguchi optimization method is judiciously employed to identify optimal operational parameters. The findings underscore superior performance with water compared to a microencapsulated PCM, attributed to the heightened specific heat of water. Moreover, when employing fluid flow, the role of the PCM in sustaining the temperature of the electronic component diminishes. Another noteworthy observation is that the integration of a fan markedly enhances the overall system performance.

Keywords:

Heatsink , phase change material , porous media , microencapsulated PCM