Heat Dissipation Performance Analysis of Semiconductor Lasers with Microchannel Structure Inspired by Biomimetic Plant Leaves

Publish Year: 1404
نوع سند: مقاله ژورنالی
زبان: English
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شناسه ملی سند علمی:

JR_JAFM-18-9_018

تاریخ نمایه سازی: 30 تیر 1404

Abstract:

Semiconductor lasers generate a significant amount of heat during operation, which can lead to various issues, including performance degradation and structural deformation of the housing. To address these challenges, this study proposes a novel cooling channel design inspired by the natural vascular architecture of plant leaves. This biomimetic design, referred to as the bionic vane cooling channel, has been optimized by manipulating key variables such as the height of the cooling gap, the angle between the primary and secondary channels, and the rate of water flow at the inlet. A comprehensive series of computational fluid dynamics (CFD) simulations and numerical analyses were conducted. The results indicate that with a constant inlet Reynolds number (Re), an increase in the height of the cooling gap significantly enhances the heat dissipation capacity. Specifically, when the cooling gap height in type I, type II, and type III structures is increased from ۲ mm to ۴ mm, the Nusselt Number (Nu) improves by ۲۵.۷۴%, ۱۲.۴۸%, and ۱۵.۸۰%, respectively. Additionally, adjusting the angle between the primary and secondary channels also increases the heat dissipation capacity. For example, increasing the angle from ۴۵° to ۶۵° results in Nu improvements of ۴۲.۰۷%, ۲۶.۰۷%, and ۳۰.۸۴% for Models I, II, and III, respectively. At a Reynolds number of ۲۰,۰۰۰, the enhancements in Nu were found to be ۹۰.۹۶%, ۳۶.۱۹%, and ۵۰.۴۱%, respectively. The study further includes a simulation analysis of the radiator's structural deformation. The findings suggest that increasing the angle between the primary and secondary channels can significantly reduce deformation. For instance, at an angle of ۴۵°, deformation exceeded ۴ × ۱۰-۳ mm, whereas at ۶۵°, the deformation was less than ۱ × ۱۰-۳ mm. This study introduces a novel approach to enhancing both the heat dissipation efficiency and the operational stability of semiconductor lasers.

Authors

Z. Hou

School of Mechanical and Vehicular Engineering, Changchun University, Changchun ۱۳۰۰۲۲, China

Z. Zhou

School of Mechanical and Vehicular Engineering, Changchun University, Changchun ۱۳۰۰۲۲, China

K. Zhang

School of Mechanical and Vehicular Engineering, Changchun University, Changchun ۱۳۰۰۲۲, China

Y. Ji

School of Mechanical and Vehicular Engineering, Changchun University, Changchun ۱۳۰۰۲۲, China

Y. Zheng

School of Mechanical and Vehicular Engineering, Changchun University, Changchun ۱۳۰۰۲۲, China

L. Wang

Jilin Science and Technology Innovation Center of Green Synthesis and New Materials Research and Development, Jilin Engineering Normal University, Changchun, Jilin ۱۳۰۰۵۲, China

S. Li

Changchun New Industries Optoelectronics Technology Co., Ltd. Lasers, Optics & Photonics, Jilin ۱۳۰۰۱۲, China

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