Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach

The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural solvers are presented. The FSI study is executed with different aspect ratio of stacked chip on the mould filling during the encapsulation process. The simulation results in the FSI study is well validated with experimental setup. The epoxy moulding compound (EMC) and structure (chip) interaction is analyzed for better understanding the FSI phenomenon.Von Mises stresses experienced by the chip also be monitored for risk of chip cracking. The proposed analysis is anticipated to be a recommendation in the chip design and improvement of 3D integration packages.

Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach Keywords:

Air void , Deformation , Moulded packaging , Stacked chip , Aspect ratio

Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach authors

M. H. H. Ishak

School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, ۱۴۳۰۰ Nibong Tebal, Penang, Malaysia

M. Z. Abdullah

School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, ۱۴۳۰۰ Nibong Tebal, Penang, Malaysia

M. S. Abdul Aziz

School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, ۱۴۳۰۰ Nibong Tebal, Penang, Malaysia

A. Abas

School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, ۱۴۳۰۰ Nibong Tebal, Penang, Malaysia

W. K. Loh

Intel Technology Sdn. Bhd, Kulim Industrial Technology Park, Kedah, Malaysia

R. C. Ooi

Intel Technology Sdn. Bhd, Kulim Industrial Technology Park, Kedah, Malaysia

C. K. Ooi

Intel Technology Sdn. Bhd, Kulim Industrial Technology Park, Kedah, Malaysia

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Link to this Paper:

https://civilica.com/doc/1378532

Document National Code:

JR_JAFM-10-6_028

Index date: 17 January 2022

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Ishak, M. H. H. and Abdullah, M. Z. and Abdul Aziz, M. S. and Abas, A. and Loh, W. K. and Ooi, R. C. and Ooi, C. K.,1396,Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach,https://civilica.com/doc/1378532

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