Molecular dynamics simulation of Al-Cu alloy and evaluation of its mechanicalproperties
Publish place: The Second International Conference on the Application of Materials and Advanced Manufacturing in Industries
Publish Year: 1401
Type: Conference paper
Language: English
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Document National Code:
IAAMM02_068
Index date: 7 August 2022
Molecular dynamics simulation of Al-Cu alloy and evaluation of its mechanicalproperties abstract
Alloys are materials that are manufactured to achieve better mechanical properties. Obtaining the bestcombination of metals in alloys to achieve the best mechanical properties has been the subject of intenseresearch. In this study, the behavior of aluminum/copper alloy is investigated. For this purpose, the effectsof changing the temperature and strain rate on the mechanical properties of the alloy were searched usingthe molecular dynamics method, which is an approach with high accuracy and close to the experimentalprocedure. The results represented that by increasing the temperature, the tensile fracture stress and yieldstress will decrease. However, the higher the strain rate is, the higher the tensile fracture stress and yieldstress are.
Molecular dynamics simulation of Al-Cu alloy and evaluation of its mechanicalproperties Keywords:
Molecular dynamics simulation of Al-Cu alloy and evaluation of its mechanicalproperties authors
Mohammad Hossein Nikzad
Department of Mechanical Engineering, University of Isfahan, ۸۱۷۴۶-۷۳۴۴۱ Isfahan,
Rasoul Mahshid
Department of Mechanical Engineering, University of Isfahan, ۸۱۷۴۶-۷۳۴۴۱ Isfahan,