Analysis of Thermal and Flow Characteristics in a Combined Cross-Flow and Jet-Flow Configuration with Flow-Guiding Fins
Publish place: Journal of Applied Fluid Mechanics، Vol: 15، Issue: 6
Publish Year: 1401
نوع سند: مقاله ژورنالی
زبان: English
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شناسه ملی سند علمی:
JR_JAFM-15-6_008
تاریخ نمایه سازی: 2 مهر 1401
Abstract:
This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. The cooling performance of four different model geometries (Models ۱, ۲, ۳, and ۴) of an electronic component was analysed by considering different jet-to-channel inlet velocity ratios (Vj/Vc) and ratios of the distance between the jet and impinging surface to jet diameter (H/D). The Vj/Vc and H/D ratios were varied in the ۰–۳ and ۲–۴ ranges, respectively, in the computational fluid dynamics analysis. The thermal and flow characteristics were revealed through a comparative result analysis, also considering results from the literature. The heat transfer improved, the Nusselt number increased, and the electronic surface temperature decreased with an increase in the Vj/Vc ratio. However, the Nusselt number decreased with an increase in the H/D ratio. Models ۲ and ۴ had higher heat transfer from the electronic component than the other models. A low H/D ratio and low Vj/Vc ratio yielded higher heat transfer in Model ۳ than in Model ۱.
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Authors
M. S. Ozturk
Department of Mechanical Engineering, Graduate School of Natural and Applied Sciences, Kirikkale University, ۷۱۴۵۰, Kirikkale, Turkey
T. Demircan
Department of Mechanical Engineering, Faculty of Engineering and Architecture, Kirikkale University, ۷۱۴۵۰, Kirikkale, Turkey
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