MODELING SURFACE TENSION AND WALL ADHESION IN MOLD FILLING PROCESS
Publish Year: 1387
نوع سند: مقاله ژورنالی
زبان: English
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شناسه ملی سند علمی:
JR_IJMSEI-5-2_001
تاریخ نمایه سازی: 26 مرداد 1402
Abstract:
Abstract: In this study an algorithm for mold-filling simulation with consideration of surface
tension has been developed based on a SOLA VOF scheme. As the governing equations, the
Navier-Stokes equations for incompressible and laminar flows were used. We proposed a way of
considering surface tension in mold-filling simulation. The proposed scheme for surface tension
was based on the continuum surface force (CSF) model we could confirm the remarkable
effectiveness of the surface tension by experiment which concluded in very positive outcome.
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