Micro/Nano Technologies for Improvement of Thermal Management of LED Packaging: A Review

More than a century after the introduction of incandescent lighting and half a century after the introduction of fluorescent lighting, solid-state light sources and especially light emitting diode (LED) are revolutionizing an increasing number of applications. Whereas theefficiency of conventional incandescent and fluorescent lights is limited by fundamental factors that cannot be overcome, the efficiency of LEDis limited only by human creativity and imagination. The high efficiency of solid-state sources already provides energy savings and environmental benefits in a number of applications. The thermal management of LED packaging modules has become moreimportant in the electronic industrials. High temperatures during lighting resulting in luminance decay, color temperature drift, life time decline and generally efficiency decrease.In this paper, we review the present state-of-the-art of thermal management methods based on the micro/nano technologies for cooling the LED package. The two main suggested solutions are implementionof micro fabrication techniques to optimum the structure of LED packages and using the nano-based thermal interface material (TIM) to dissipate heat from LED chips.

Keywords:

LED , Energy efficiency , Thermal management , Micro fabrication techniques , Nano-based thermal interface material