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Effect of Electroless Plating Conditions on Ni-Sn-P Coatings, Properties

Publish Year: 1396
Type: Conference paper
Language: English
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Document National Code:

IMES11_329

Index date: 26 February 2018

Effect of Electroless Plating Conditions on Ni-Sn-P Coatings, Properties abstract

In this study, the electroless Ni-Sn-P coatings with different compositions were deposited on the copper substrate. To investigate the effect of plating condition on Ni-Sn-P coatings, properties, time (20-40 minute) and temperature of electroless plating (80-88℃) were changed. Surface composition and surface morphology of coatings were studied by Energy Dispersive Spectroscopy (EDS) and Field Emission Scanning Electron Microscope (FESEM) respectively. Corrosion behavior of coatings was studied by electrochemical tests in 10 wt % acid sulfuric. Results showed that changes in time and temperature of electroless plating led to changes in Ni, Sn, P contents, deposition rate, and surface morphology of coatings. Coatings that obtained at higher times and temperatures of electroless plating showed a nodular structure with bigger nodule size. Results of corrosion behavior tests in 10 wt % acid sulfuric showed that coating with higher tin content had the best corrosion behavior.

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Effect of Electroless Plating Conditions on Ni-Sn-P Coatings, Properties authors

Mahnaz Yaghoobi

Master of corrosion engineering Faculty of materials engineering, Sahand University of technology, Tabriz, Iran

Naghi Parvini Ahmadi

Professor of materials science and engineering, Faculty of materials engineering, Sahand University of technology, Tabriz, Iran

Parvaneh Asl Farshbaf

Master of corrosion engineering, Sahand University of Technology, Faculty of materials engineering, Sahand University of technology, Tabriz, Iran