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فیلتر نتایج
Conference Paper
Mechanical behavior of Sn-Cu-Bi-xCr (x= ۰ and ۰.۰۱ wt.%) lead-free solder: numerical and experimental studies
Authors:
Roxana Rashidi
،
Homam Naffakh-Moosavy
Year 1399
Publish place:
3rd International Conference on Welding and Non-Destructive Testing of Iran, 21st National Conference on Welding and Inspection and 10th National Conference on Non-Destructive Testing
Pages:
7
| Language: English
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Conference Paper
A comparative study on microstructures and mechanical properties of Sn-۰.۸Cu and Sn-۸Cr lead-free solders
Authors:
Roxana Rashidi
،
Homam Naffakh-Moosavy
Year 1399
Publish place:
9th International Conference & Exhibition on Materials Science & Metallurgical Engineering (iMat2020)
Pages:
10
| Language: English
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Conference Paper
Influence of minor Chromium addition on thermal properties and wetting characteristics of Sn-۰.۸Cu-۱.۸Bisolder alloy on Cu substrate
Authors:
Roxana Rashidi
،
Homam Naffakh-Moosavy
Year 1399
Publish place:
9th International Conference & Exhibition on Materials Science & Metallurgical Engineering (iMat2020)
Pages:
10
| Language: English
View And Download