the effects of bonding temperature on the microstructure and strength of 410ss/Cu diffusion -bonded joint

in this present study a grade of stainless steel 410 and copper plates were joined together through diffusion bonding process at temperature range of 800-950 c . These were performed through hot pressing the specimens under 12 Mpa pressure for 60 min under 10-4 torr vacuum the microstructure and phase constitution near the diffusion bonding interface of SS/Cu were studied using optical microscope OM scanning electron microscope SEM ,X-ray diffraction XRD and elemental analyses through energy dispersive spectrometry EDS the results show the oxide layer which formed on copper surface was restricted the diffusion of atoms in interfaces during the vacuum diffusion bonding .

Keywords:

diffusion bonding , martensitic stainless steel , interface microstructure , EPMA , shear strength