Recovery of Pb and Cu from Printed Circuit Boards (PCB) inAcidic Media
Publish Year: 1403
Type: Conference paper
Language: English
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IMES18_260
Index date: 1 January 2025
Recovery of Pb and Cu from Printed Circuit Boards (PCB) inAcidic Media abstract
study used a selective two step dissolution method with two different approaches. In first approach, thehydrochloric acid was used as leaching agent to selectively dissolved Pb under a temperature of 75 °C. In thesecond approach, oxidative leaching was used to dissolve Cu under ambient temperature. According to AASanalysis, the Pb and Cu recoveries at first approach is 6.29 %, 0.03 %, for second approach the recoveries are27.1% and 74.23 %, respectively. In second approach, sulfuric acid and hydrogen peroxide were used asleaching and oxidant agent. The recoveries of Pb and Cu for first approach were 0.85% and 5.61%,respectively. Whereas in the second stage of the second approach, thiourea acid was evaluated along withsulfuric acid and hydrogen peroxide for further dissolution of Cu. Pb and Cu recovery were 5.43 % and 2.21%, respectively.
Recovery of Pb and Cu from Printed Circuit Boards (PCB) inAcidic Media Keywords:
Recovery of Pb and Cu from Printed Circuit Boards (PCB) inAcidic Media authors
Sadaf Samadi Tavana
Master student, Department of, Metallurgy and Materials Hamedan University of Technology, Hamedan, Iran
Mohammad Ebrahim Haghnazari
Master student, Department of, Metallurgy and Materials Hamedan University of Technology, Hamedan, Iran
Saeid Karimi
Assistant professor, Department of Metallurgy and Materials Engineering, Hamedan University of Technology, Hamedan, Iran
