An Investigation on the Modeling of Heat Distribution and Atomic Diffusion in the Joining of the AA۲۰۲۴-T۴ to AA۶۰۶۱-T۶ by TLP Process

The simulation of heat distribution has long been applied for estimating optimal time for heat treatment process in an attempt to optimize the energy consumption. Aluminum alloys have been used to achieve appropriate strength-to-weight ratio and reduce the fuel consumption. In the present research, heat distribution modeling was performed for joining AA۲۰۲۴-T۴ to AA۶۰۶۱-T۶ in the TLP process utilizing MATALAB R۲۰۱۶b. For this purpose, thermal properties and density of the base alloys and the clamp were extracted from respective ASM standards and applied in the coding. Finally, ۱D, and ۲D simulations were run to simulate the heat distribution over the base metal at the process temperature. Moreover, the time required to have the copper diffused into the interlayer was estimated through the simulations. The diffusion depth of the Sn into the base metal (Al) was further modeled at different points in time. A Sn-۲.۵Bi interlayer with two different thicknesses (۵۰ and ۷۰ microns) was also evaluated through actual experiments.

Keywords:

TLP , Modeling by MATLAB , AA۲۰۲۴-T۴ , Heat Distribution , Atomic Diffusion