Effect of temperature on microstructure of multi-layer diffusion bonded stainless steel

Diffusion bonding is a solid-state bonding method in which two materials are bonded under pressure at a temperature below the melting point of the material. Severaltechniques have been used to connect 316 stainless steel plates of heat exchangers, but these processes have not been very successful due to the obstruction of the passages by the compacted fillers. Hence the diffusion bonding to connect the plates is quite promising. By controlling the required conditions of the diffusion bonding such as temperature, time, pressure and the amount of vacuum, we reached a uniform connection and the examination of the microstructural images of the bond line shows a suitable connection without discontinuity.

Keywords:

Diffusion Bonding , Stainless Steel , Multi-layer , Microstructure , Temperature , pressure , vacuum.